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NX3V1G66
Low-ohmic single-pole single-throw analog switch
Rev. 05 -- 24 March 2010 Product data sheet
1. General description
The NX3V1G66 provides one single-pole single-throw analog switch function. It has two input/output terminals (Y and Z) and an active HIGH enable input pin (E). When pin E is LOW, the analog switch is turned off. Schmitt trigger action at the enable input (E) makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 1.4 V to 4.3 V. The NX3V1G66 allows signals with amplitude up to VCC to be transmitted from Y to Z or from Z to Y. Its ultra-low ON resistance (0.3 ) and flatness (0.1 ) ensures minimal attenuation and distortion of transmitted signals.
2. Features
Wide supply voltage range from 1.4 V to 4.3 V Very low ON resistance (peak): 0.8 (typical) at VCC = 1.4 V 0.5 (typical) at VCC = 1.65 V 0.3 (typical) at VCC = 2.3 V 0.25 (typical) at VCC = 2.7 V 0.25 (typical) at VCC = 4.3 V High noise immunity ESD protection: HBM JESD22-A114F Class 3A exceeds 7500 V MM JESD22-A115-A exceeds 200 V CDM AEC-Q100-011 revision B exceeds 1000 V CMOS low-power consumption Latch-up performance exceeds 100 mA per JESD78B Class II Level A Direct interface with TTL levels at 3.0 V Control input accepts voltages above supply voltage High current handling capability (500 mA continuous current under 3.3 V supply) Specified from -40 C to +85 C and from -40 C to +125 C
3. Applications
Cell phone PDA Portable media player
NXP Semiconductors
NX3V1G66
Low-ohmic single-pole single-throw analog switch
4. Ordering information
Table 1. Ordering information Package Temperature range NX3V1G66GW NX3V1G66GM -40 C to +125 C -40 C to +125 C Name Description Version SOT353-1 SOT886 TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm Type number
5. Marking
Table 2. Marking codes[1] Marking code dL dL Type number NX3V1G66GW NX3V1G66GM
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
E Z Y
Y
Z
E
001aag487 001aah372
Fig 1.
Logic symbol
Fig 2.
Logic diagram
7. Pinning information
7.1 Pinning
NX3V1G66 NX3V1G66
Y Z 1 2 GND GND 3
001aai328
Y 5 VCC
1
6
VCC
Z
2
5
n.c.
3
4
E
4
E
001aah832
Transparent top view
Fig 3. Pin configuration SOT353-1 (TSSOP5)
Fig 4.
Pin configuration SOT886 (XSON6)
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Product data sheet
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
7.2 Pin description
Table 3. Symbol Y Z GND E n.c. VCC Pin description Pin SOT353-1 1 2 3 4 5 SOT886 1 2 3 4 5 6 independent input or output independent output or input ground (0 V) enable input (active HIGH) not connected supply voltage Description
8. Functional description
Table 4. Input E L H
[1] H = HIGH voltage level; L = LOW voltage level.
Function table[1] Switch OFF-state ON-state
9. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC VI VSW IIK ISK ISW Parameter supply voltage input voltage switch voltage input clamping current switch clamping current switch current VI < -0.5 V VI < -0.5 V or VI > VCC + 0.5 V VSW > -0.5 V or VSW < VCC + 0.5 V; source or sink current VSW > -0.5 V or VSW < VCC + 0.5 V; pulsed at 1 ms duration, < 10 % duty cycle; peak current Tstg Ptot
[1] [2] [3]
Conditions enable input E
[1] [2]
Min -0.5 -0.5 -0.5 -50 -
Max +4.6 +4.6 50 500 750
Unit V V mA mA mA mA
VCC + 0.5 V
storage temperature total power dissipation Tamb = -40 C to +125 C
[3]
-65 -
+150 250
C mW
The minimum input voltage rating may be exceeded if the input current rating is observed. The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not exceed 4.6 V. For TSSOP5 package: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
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Product data sheet
Rev. 05 -- 24 March 2010
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
10. Recommended operating conditions
Table 6. VCC VI VSW Tamb t/V
[1]
Recommended operating conditions Conditions enable input E
[1]
Symbol Parameter supply voltage input voltage switch voltage ambient temperature input transition rise and fall rate
Min 1.4 0 0 -40 -
Max 4.3 4.3 VCC +125 200
Unit V V V C ns/V
VCC = 1.4 V to 4.3 V
[2]
To avoid sinking GND current from terminal Z when switch current flows in terminal Y, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal Z, no GND current will flow from terminal Y. In this case, there is no limit for the voltage drop across the switch. Applies to control signal levels.
[2]
11. Static characteristics
Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground 0 V). Symbol Parameter Conditions Min VIH HIGH-level input voltage VCC = 1.4 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 3.6 V to 4.3 V VIL LOW-level input voltage VCC = 1.4 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 3.6 V to 4.3 V II input leakage current OFF-state leakage current ON-state leakage current enable input E; VI = GND to 4.3 V; VCC = 1.4 V to 4.3 V Y port; see Figure 5 VCC = 1.4 V to 3.6 V VCC = 3.6 V to 4.3 V Z port; see Figure 6 VCC = 1.4 V to 3.6 V VCC = 3.6 V to 4.3 V 5 10 50 50 500 500 nA nA 5 10 50 50 500 500 nA nA 0.65VCC 1.7 2.0 0.7VCC Tamb = 25 C Typ Max 0.35VCC 0.7 0.8 0.3VCC Tamb = -40 C to +125 C Min 0.65VCC 1.7 2.0 0.7VCC Max Max (85 C) (125 C) 0.7 0.8 0.3VCC 0.5 0.7 0.8 1 V V V V V V A Unit
0.35VCC 0.35VCC V
0.3VCC V
IS(OFF)
IS(ON)
ICC
supply current VI = VCC or GND; VSW = GND or VCC VCC = 3.6 V VCC = 4.3 V 100 150 690 800 6000 7000 nA nA
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Product data sheet
Rev. 05 -- 24 March 2010
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
Table 7. Static characteristics ...continued At recommended operating conditions; voltages are referenced to GND (ground 0 V). Symbol Parameter Conditions Min CI CS(OFF) CS(ON) input capacitance OFF-state capacitance ON-state capacitance Tamb = 25 C Typ 1.0 70 205 Max Tamb = -40 C to +125 C Min Max Max (85 C) (125 C) pF pF pF Unit
11.1 Test circuits
VCC VIL E Z GND Y VIH IS
VO VI
VCC E Z GND Y
IS
VI
VO
001aag488
001aag489
VI = 0.3 V or VCC - 0.3 V; VO = VCC - 0.3 V or 0.3 V.
VI = 0.3 V or VCC - 0.3 V; VO = open circuit.
Fig 5.
Test circuit for measuring OFF-state leakage current
Fig 6.
Test circuit for measuring ON-state leakage current
11.2 ON resistance
Table 8. Resistance RON At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 8 to Figure 14. Symbol RON(peak) Parameter ON resistance (peak) Conditions VI = GND to VCC; ISW = 100 mA; see Figure 7 VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 2.7 V VCC = 4.3 V 0.8 0.5 0.3 0.25 0.25 1.9 0.8 0.5 0.45 0.45 2.1 0.9 0.6 0.5 0.5 Tamb = -40 C to +85 C Tamb = -40 C to +125 C Unit Min Typ[1] Max Min Max
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Product data sheet
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
Table 8. Resistance RON ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 8 to Figure 14. Symbol RON(flat) Parameter ON resistance (flatness) Conditions VI = GND to VCC; ISW = 100 mA VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 2.7 V VCC = 4.3 V
[1] [2] Typical values are measured at Tamb = 25 C. Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature.
[2]
Tamb = -40 C to +85 C Tamb = -40 C to +125 C Unit Min Typ[1] Max Min Max
-
0.5 0.25 0.1 0.1 0.1
1.7 0.6 0.2 0.2 0.25
-
1.8 0.7 0.2 0.2 0.25

11.3 ON resistance test circuit and graphs
0.8 RON () 0.6 VSW
(1) 001aah800
VCC VIH E Z GND Y
0.4
(2) (3) (4)
0.2
(5)
(6)
VI
ISW
0 0
001aah375
1
2
3
4 VI (V)
5
RON = VSW / ISW.
(1) VCC = 1.5 V. (2) VCC = 1.8 V. (3) VCC = 2.5 V. (4) VCC = 2.7 V. (5) VCC = 3.3 V. (6) VCC = 4.3 V. Measured at Tamb = 25 C.
Fig 7.
Test circuit for measuring ON resistance
Fig 8.
Typical ON resistance as a function of input voltage
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Product data sheet
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
0.8 RON () 0.6
001aah805
0.6 RON () 0.4
(1)
001aah801
0.4
(1) (2) (3)
(2) (3)
0.2
(4)
0.2
(4)
0 0 1 2 VI (V) 3
0 0 1 2 VI (V) 3
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = -40 C.
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = -40 C.
Fig 9.
ON resistance as a function of input voltage; VCC = 1.5 V
Fig 10. ON resistance as a function of input voltage; VCC = 1.8 V
0.6 RON () 0.4
(1) (2) (3)
001aah802
0.6 RON () 0.4
(1) (2) (3)
001aah803
0.2
(4)
0.2
(4)
0 0 1 2 VI (V) 3
0 0 1 2 VI (V) 3
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = -40 C.
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = -40 C.
Fig 11. ON resistance as a function of input voltage; VCC = 2.5 V
Fig 12. ON resistance as a function of input voltage; VCC = 2.7 V
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Product data sheet
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NXP Semiconductors
NX3V1G66
Low-ohmic single-pole single-throw analog switch
0.6 RON () 0.4
(1) (2)
001aah804
0.6 RON () 0.4
(1) (2) (3) (4)
001aaj895
0.2
(3) (4)
0.2
0 0 1 2 3 VI (V) 4
0 0 1 2 3 4 VI (V) 5
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = -40 C.
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (4) Tamb = -40 C.
Fig 13. ON resistance as a function of input voltage; VCC = 3.3 V
Fig 14. ON resistance as a function of input voltage; VCC = 4.3 V
12. Dynamic characteristics
Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit Figure 16. Symbol Parameter Conditions Tamb = 25 C Min ten enable time E to Y; see Figure 15 VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 3.6 V to 4.3 V tdis disable time E to Y; see Figure 15 VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 3.6 V to 4.3 V
[1]
Tamb = -40 C to +125 C Unit Min Max (85 C) 45 38 29 25 25 23 17 11 10 10 Max (125 C) 49 41 31 28 28 26 19 12 11 11 ns ns ns ns ns ns ns ns ns ns
Typ[1]
Max
-
28 23 17 15 15 12 9 6 5 5
42 35 27 24 24 22 16 10 9 9
-
Typical values are measured at Tamb = 25 C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively.
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Product data sheet
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
12.1 Waveform and test circuits
VI E input GND
ten tdis
VM
Y output OFF to HIGH HIGH to OFF
VOH
VX
VX
GND
switch disabled switch enabled switch disabled
001aah875
Measurement points are given in Table 10. Logic level: VOH is the typical output voltage that occurs with the output load.
Fig 15. Enable and disable times Table 10. VCC 1.4 V to 4.3 V Measurement points Input VM 0.5VCC Output VX 0.9VOH
Supply voltage
VCC E Y/Z Z/Y
G
VI
V
VO
RL
CL
VEXT = 1.5 V
001aah377
Test data is given in Table 11. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. VEXT = External voltage for measuring switching times.
Fig 16. Load circuit for switching times Table 11. VCC 1.4 V to 4.3 V Test data Input VI VCC tr, tf 2.5 ns Load CL 35 pF RL 50
Supply voltage
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Product data sheet
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
12.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise specified); tr = tf 2.5 ns; Tamb = 25 C. Symbol Parameter THD total harmonic distortion Conditions fi = 20 Hz to 20 kHz; RL = 32 ; see Figure 17 VCC = 1.4 V; VI = 1 V (p-p) VCC = 1.65 V; VI = 1.2 V (p-p) VCC = 2.3 V; VI = 1.5 V (p-p) VCC = 2.7 V; VI = 2 V (p-p) VCC = 4.3 V; VI = 2 V (p-p) f(-3dB) iso Vct -3 dB frequency response isolation (OFF-state) crosstalk voltage RL = 50 ; see Figure 18 VCC = 1.4 V to 4.3 V fi = 100 kHz; RL = 50 ; see Figure 19 VCC = 1.4 V to 4.3 V between digital input and switch; fi = 1 MHz; CL = 50 pF; RL = 50 ; see Figure 20 VCC = 1.4 V to 3.6 V VCC = 3.6 V to 4.3 V Qinj charge injection fi = 1 MHz; CL = 0.1 nF; RL = 1 M; Vgen = 0 V; Rgen = 0 ; see Figure 21 VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 4.3 V
[1] fi is biased at 0.5VCC.
[1] [1] [1]
Min -
Typ 0.05 0.03 0.01 0.01 0.01 25 -90
Max -
Unit % % % % % MHz dB
-
0.3 0.5
-
V V
-
6.5 6.5 6.5 6.5 12
-
pC pC pC pC pC
12.3 Test circuits
VCC VIH E Y/Z Z/Y 0.5VCC
RL
fi
D
001aah378
Fig 17. Test circuit for measuring total harmonic distortion
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Product data sheet
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
VCC VIH E Y/Z Z/Y
0.5VCC
RL
fi
dB
001aah379
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads -3 dB.
Fig 18. Test circuit for measuring the frequency response when switch is in ON-state
0.5VCC VIL E Y/Z
VCC
0.5VCC
RL
RL
Z/Y
fi
dB
001aah380
Adjust fi voltage to obtain 0 dBm level at input.
Fig 19. Test circuit for measuring isolation (OFF-state)
VCC E Y/Z Z/Y
G
VI
RL
RL
CL
V
VO
0.5VCC
0.5VCC
001aah383
a. Test circuit
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Product data sheet
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NX3V1G66
Low-ohmic single-pole single-throw analog switch
logic input (E)
off
on
off
VO
Vct
001aah381
b. Input and output pulse definitions Fig 20. Test circuit for measuring crosstalk voltage between digital input and switch
VCC E Y/Z Z/Y Rgen
G
VI
V
VO
RL
CL
Vgen GND
001aah385
a. Test circuit.
logic input (E)
off
on
off
VO
VO
001aah384
b. Input and output pulse definitions.
Definition: Qinj = VO x CL. VO = output voltage variation. Rgen = generator resistance. Vgen = generator voltage.
Fig 21. Test circuit for measuring charge injection
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Low-ohmic single-pole single-throw analog switch
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1
D
E
A X
c y HE vMA
Z
5
4
A2 A1 (A3) A
1
e e1 bp
3
wM detail X
Lp L
0
1.5 scale
3 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 7 0
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19
Fig 22. Package outline SOT353-1 (TSSOP5)
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Product data sheet
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Low-ohmic single-pole single-throw analog switch
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b 1 2 3 4x L1 L
(2)
e
6 e1
5 e1
4
6x
(2)
A
A1 D
E
terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm
Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22
Fig 23. Package outline SOT886 (XSON6)
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Product data sheet
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Low-ohmic single-pole single-throw analog switch
14. Abbreviations
Table 13. Acronym CDM CMOS ESD HBM MM PDA TTL Abbreviations Description Charged Device Model Complementary Metal-Oxide Semiconductor ElectroStatic Discharge Human Body Model Machine Model Personal Digital Assistant Transistor-Transistor Logic
15. Revision history
Table 14. Revision history Release date 20100324 20100208 Data sheet status Product data sheet Product data sheet Change notice Supersedes NX3V1G66_4 NX3V1G66_3 Document ID NX3V1G66_5 NX3V1G66_4 Modifications: NX3V1G66_3 NX3V1G66_2 NX3V1G66_1
* *
Figure 5: Test circuit drawing has changed. Table 8: ON resistance (flatness) changed at VCC = 4.3 V. Product data sheet Product data sheet Product data sheet NX3V1G66_2 NX3V1G66_1 -
20090409 20080728 20080421
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Low-ohmic single-pole single-throw analog switch
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications -- This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be
NX3V1G66_5
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 24 March 2010
16 of 18
NXP Semiconductors
NX3V1G66
Low-ohmic single-pole single-throw analog switch
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NX3V1G66_5
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 -- 24 March 2010
17 of 18
NXP Semiconductors
NX3V1G66
Low-ohmic single-pole single-throw analog switch
18. Contents
1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 11.2 11.3 12 12.1 12.2 12.3 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ON resistance test circuit and graphs. . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveform and test circuits . . . . . . . . . . . . . . . . 9 Additional dynamic characteristics . . . . . . . . . 10 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 March 2010 Document identifier: NX3V1G66_5

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